Quality Assurance

At our company, we take quality assurance seriously. We only source products from reputable suppliers and conduct strict quality control checks before shipping to ensure our customers receive high-quality components that meet industry standards.

Reliable Testing and Analysis
As a leading manufacturer of advanced electronics, we ensure the quality and reliability of our products through comprehensive testing and analysis of our electronic components. From initial design to final production, our teams of experienced engineers and technicians conduct a range of tests to ensure that our components meet the highest standards.
This includes hardware and software testing, performance analysis, reliability testing, and environmental testing to ensure that our components are durable, reliable, and efficient. We use advanced testing equipment and facilities, as well as specialized software tools, to ensure that our components meet the most demanding requirements of our customers.
In addition to our internal testing processes, we also work closely with third-party testing facilities to ensure that our components meet the highest standards. These testing facilities have state-of-the-art facilities and expertise in a wide range of fields, including hardware and software testing, and environmental testing.
Working with our third-party testing facilities offers a number of benefits, including:
  • Comprehensive testing and engineering consulting that is tailored to our specific needs
  • Access to 10 years of experience and knowledge in testing and analysis for new projects
  • Proven support for defense, space, aerospace, electronics, medical, automotive, satellite, and durable goods applications
  • A reliable and reliable source for component-level electrical and environmental testing, radiation testing, failure analysis, and destructive or nondestructive physical testing and analysis.
Overall, our partnership with third-party testing facilities ensures that our components meet the highest standards and are ready for market.
 Testing Agency
Capabilities Overview
Our third-party laboratories and their Electronic Component Test and Analysis team specialize in testing and analyzing electronic components such as diodes, transistors, inductors, capacitors, resistors, and chips. The test laboratory has extensive experience in developing test software to electrically and environmentally characterize virtually any electronic component, including analog, digital, mixed-signal, converters, FPGAs, and ASICs. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanations for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Electronic Component Test and Analysis team offers a 10-year history of test and analysis data – a valuable resource for addressing new customer requirements.
Component Evaluation and Test Lab – A full-service facility that evaluates and tests components for commercial, airborne, military, space and other applications. Capabilities include testing for design verification, component characterization, upgrade, screening, qualification, and environmental factors. Other special services: radiation characterization and lot acceptance testing, latch-up, single event upset, and neutron testing.
Failure Analysis and Destructive Physical Analysis – A full-service facility that provides analytical expertise and tools necessary to determine the root-cause explanation for any electrical, mechanical, or material issues related to component or assembly failures. The lab also performs destructive analyses to ascertain the compliance of a manufacturer’s process and workmanship, and to ensure that high-reliability components or assemblies are fabricated to the required standards. Additional tests and analysis capabilities are processed as technical service requests.
Counterfeit Parts Detection Mitigation Solution
YXS TECHNOLOGY  are fully qualified to address the proliferation of counterfeit, remarked and recycled parts and materials in the electronics manufacturing industry. Our parts history database spans 10 years, allowing us to compare records of known parts with our test results to draw conclusions about material integrity, manufacturing methods and origin.
With state-of-the-art facilities and knowledgeable teams of technical professionals, CTAL serves a wide range of government and commercial clients. Our capabilities are honed to meet customers’ counterfeit mitigation needs and focus on ever-changing threats to the supply chain. We provide centralized component-level electrical testing, failure analysis, counterfeit components detection and destructive or nondestructive physical testing for programs and projects of all sizes. Some of the benefits of working with our team include:
  • Proven lab support for sophisticated defense, space, aerospace, and electronics products and systems as well as for medical, automotive and durable goods applications
  • Comprehensive engineering consulting services tailored to customer needs
  • A single, reliable source for a broad spectrum of testing, analysis, design and development services
Testing Equipment
Storage and packaging
Reliable Testing and Analysis
Electrical Testing
  • Digital, linear, ASICs
  • Wafer probing
  • Semiconductors
  • RF and microwave
  • Passive and magnetics
  • Opto-electronics
  • Time Domain Reflectometry (TDR)
Radiation Testing
  • Total dose gamma
  • Neutron Fluence
  • Dose Rate
  • Single Event Environments
Environmental Testing
  • Burn-in
  • Temperature cycling
  • Humidity
  • Constant acceleration
  • Data acquisition
  • Highly accelerated stress test (HAST)
  • Thermal shock
Component Failure Analysis and Destructive Physical Analysis
  • Radiography (real-time and computed tomography (CT))
  • Infrared thermography (hot spot detection)
  • Infrared thermal mapping
  • Photoemission microscopy
  • Scanning electron microscopy (SEM)
  • Energy Dispersive X-ray analysis
  • C-mode Scanning Acoustic Microscopy (C-SAM)
  • Cross-sectional and metallographic analysis
  • Chemical decapsulation/depotting
  • Mechanical delidding
  • Particle retrieval and analysis
  • Dye penetrant examination
  • Dimensional measurements
  • Photomicrography
  • Die/ball/bump shear, bond pull
  • NAS 410 Level III in radiographic testing (RT), ultrasonic testing (UT), penetrant testing (PT)
  • AS9100
  • IDEA-ICE-3000
Special Capabilities
  • Counterfeit components identification
  • Prohibited materials testing (in-house or off-site)
  • Materials analysis
    • Thermal Analysis (TGA/DSC/TMA)
    • Gas Chromatography/Mass Spectroscopy
    • Fourier Transform Infrared Spectroscopy (FTIR)
    • Raman Spectroscopy
    • Hardness (Rockwell, Knoop, Vickers, and Shore)
    • Tensile Strength, Elongation, and Fatigue
  • Construction analysis
  • Fractography
  • Semiconductor (die-level) microprobing
  • Particle impact noise detection (PIND)
  • Hermetic seal testing (fine and gross)
  • Lot evaluation (LAT, freshness, screening)
  • Microhardness testing (Vickers, Knoop)
  • Hardness testing (Rockwell)
  • Solderability testing
  • Analytical Modeling of Mechanical Systems
  • PWB inspection
  • Failure Analysis
  • Focused Ion Beam
    • Cross Sectional Analysis
    • Circuit Edits
    • Elemental Analysis
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